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Various sizes and materials
to meet all needs
- Applications
- Semiconductors
Flat Panel Display-related manufacturing equipment, etc.
- Form of delivery
- Cast products, forged products (block shape),
3D printer formed products
- Material properties (example of measurement)
-
Classification:
Low carbon LEXProperties:
Zero expansion, low thermal expansion, forgeable
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | 0±0.19 | Expansion (%) | 28 |
| Lower limit of application temperature (℃) | -30 | Hardness (HB) | 137 |
| 0.2% yield strength (N/mm2) | 264 | Young’s modulus (GPa) | 133 |
| Tensile strength (N/mm2) | 378 | Thermal conductivity W（/ m・K) | 13.8 |
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | 0±0.19 |
| Expansion (%) | 28 |
| Lower limit of application temperature (℃) | -30 |
| Hardness (HB) | 137 |
| 0.2% yield strength (N/mm2) | 264 |
| Young’s modulus (GPa) | 133 |
| Tensile strength (N/mm2) | 378 |
| Thermal conductivity W（/ m・K) | 13.8 |
- *The above physical property values are for cast products.
- *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
- *Young’s modulus is measured using the bending resonance method.
- *Contents are subject to change without notice.
