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Various sizes and materials
to meet all needs
- Applications
- Semiconductor-related manufacturing equipment,
aerospace-related parts, etc.
- Form of delivery
- Cast products, forged products (block shape)
- Material properties (example of measurement)
-
Classification:
Low carbon LEXProperties:
Co1% or less, low thermal expansion, forgeable
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | ≦1.5 | Expansion (%) | 29 |
| Lower limit of application temperature (℃) | -196 | Hardness (HB) | – |
| 0.2% yield strength (N/mm2) | 198 | Young’s modulus (GPa) | 125 |
| Tensile strength (N/mm2) | 340 | Thermal conductivity W（/ m・K) | – |
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | ≦1.5 |
| Expansion (%) | 29 |
| Lower limit of application temperature (℃) | -196 |
| Hardness (HB) | – |
| 0.2% yield strength (N/mm2) | 198 |
| Young’s modulus (GPa) |
125 |
| Tensile strength (N/mm2) | 340 |
| Thermal conductivity W（/ m・K) | – |
- *The above physical property values are for cast products.
- *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
- *Young’s modulus is measured using the bending resonance method.
- *Contents are subject to change without notice.
- Applications
- Semiconductor-related manufacturing equipment,
aerospace-related parts, etc.
- Form of delivery
- Cast products, forged products (block shape)
- Material properties (example of measurement)
-
Classification:
Low carbon LEXProperties:
Low thermal expansion, forgeable, better mechanical properties than IF2
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | ≦1.5 | Expansion (%) | 32 |
| Lower limit of application temperature (℃) | -196 | Hardness (HB) | – |
| 0.2% yield strength (N/mm2) | 212 | Young’s modulus (GPa) | 125 |
| Tensile strength (N/mm2) | 357 | Thermal conductivity W（/ m・K) | 13.5 |
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | ≦1.5 |
| Expansion (%) | 32 |
| Lower limit of application temperature (℃) | -196 |
| Hardness (HB) | – |
| 0.2% yield strength (N/mm2) | 212 |
| Young’s modulus (GPa) |
125 |
| Tensile strength (N/mm2) | 357 |
| Thermal conductivity W（/ m・K) | 13.5 |
- *The above physical property values are for cast products.
- *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
- *Young’s modulus is measured using the bending resonance method.
- *Contents are subject to change without notice.
- Applications
- Semiconductor-related manufacturing equipment, etc.
- Form of delivery
- Cast product
- Material properties (example of measurement)
-
Classification:
High-carbon LEXProperties:
Optimum low thermal expansion coefficient can be selected from a range of 1×ppm/℃ or less or 1 to 6×ppm/℃, castability, machinability, and low temperature stability
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | 1.0〜2.0 | Expansion (%) | 15 |
| Lower limit of application temperature (℃) | -196 | Hardness (HB) | 135 |
| 0.2% yield strength (N/mm2) | 260 | Young’s modulus (GPa) | 130 |
| Tensile strength (N/mm2) | 440 | Thermal conductivity W（/ m・K) | 14.0 |
| Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) | 1.0〜2.0 |
| Expansion (%) | 15 |
| Lower limit of application temperature (℃) | -196 |
| Hardness (HB) | 135 |
| 0.2% yield strength (N/mm2) | 260 |
| Young’s modulus (GPa) |
130 |
| Tensile strength (N/mm2) | 440 |
| Thermal conductivity W（/ m・K) | 14.0 |
- *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
- *Young’s modulus is measured using the ultrasonic pulse method.
- *Contents are subject to change without notice.
