カテゴリー

Various sizes and materials
to meet all needs

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Applications
Semiconductors
Flat Panel Display-related manufacturing equipment, etc.
Form of delivery
Cast products, forged products (block shape),
3D printer formed products
Material properties (example of measurement)

Classification:
Low carbon LEX

Properties:
Zero expansion, low thermal expansion, forgeable

Average coefficient of thermal expansion x ppm/℃ (10 to 40℃)0±0.19Expansion (%)28
Lower limit of application temperature (℃)-30Hardness (HB)137
0.2% yield strength (N/mm2)264Young’s modulus (GPa)133
Tensile strength (N/mm2)378Thermal conductivity W(/ m・K)13.8
Average coefficient of thermal expansion x ppm/℃ (10 to 40℃)0±0.19
Expansion (%)28
Lower limit of application temperature (℃)-30
Hardness (HB)137
0.2% yield strength (N/mm2)264
Young’s modulus (GPa)
133
Tensile strength (N/mm2)378
Thermal conductivity W(/ m・K)13.8
  • *The above physical property values are for cast products.
  • *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
  • *Young’s modulus is measured using the bending resonance method.
  • *Contents are subject to change without notice.

画像
Applications
Semiconductors, optical parts, etc.
Form of delivery
Cast products, forged products (block shape)
Material properties (example of measurement)

Classification:
Low carbon LEX

Properties:
Super Invar (equivalent),
extremely low thermal expansion, forgeable

Average coefficient of thermal expansion x ppm/℃ (10 to 40℃)≦0.8 Expansion (%)30
Lower limit of application temperature (℃)-50 Hardness (HB)133
0.2% yield strength (N/mm2)277 Young’s modulus (GPa)128
Tensile strength (N/mm2)372 Thermal conductivity W(/ m・K)13.1
Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) ≦0.8
Expansion (%) 30
Lower limit of application temperature (℃) -50
Hardness (HB) 133
0.2% yield strength (N/mm2) 277
Young’s modulus (GPa)
128
Tensile strength (N/mm2) 372
Thermal conductivity W(/ m・K) 13.1
  • *The above physical property values are for cast products.
  • *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
  • *Young’s modulus is measured using the bending resonance method.
  • *Contents are subject to change without notice.